摘要
作为电子封装领域的关键辅助材料,底部填充胶有其特定的使用要求和性能特点。本文分析了底部填充胶在使用中存在的关键问题,介绍了底部填充胶用环氧树脂的研究进展,对底部填充胶的未来发展提出了展望。
As a critical auxiliary material in the field of electronic packaging.underfill acdhesive had itsspecific application requirements and performance characteristics.In this paper.the key problems existing in theuse of underfill adhesive were analyzed,the research progress of epoxy resin for underfill adlhesive was introducedl.andl the prospect for the future development of underfill adhesive was put forward.
作者
甘禄铜
刘鑫
李勇
Gan Lutong;Liuo Xin;Li Yong(China Adhesives and Tape Industry Association,Beijing 100027,China;China National Chemical Information Center Co..Ltd.,Beijing 100029,China)
出处
《中国胶粘剂》
CAS
2022年第1期60-64,68,共6页
China Adhesives
关键词
电子封装
底部填充胶
环氧树脂
electronic packaging
underfill adhesive
epoxy resin
