某型红外热像仪结构改进设计研究

Structural Improvement Design of an Infrared Thermal Imager

红外热像仪机械环境可靠性是其结构设计最为重要的指标之一。为保证红外热像仪能够经受服役的振动环境,本文以某型红外热像仪故障闭环为契机开展失效机理及结构改进设计研究。基于动态试验结果对红外热像仪有限元模型进行修正。采用有限元数值方法和随机振动疲劳失效理论相结合对故障的产生机理进行了推测。根据分析结果重新对结构改进优化并通过疲劳失效理论和随机振动试验进行了验证。结果表明故障定位准确、提出的优化改进措施有效。本文的分析思路对单机传感器设计或故障定位、结构改进设计等具有一定参考意义。

The mechanical environment reliability of infrared thermal imagers is one of the most important indices in its structural design.To ensure that the infrared thermal imager can withstand the vibration environment during operation,a fault closed loop of an infrared thermal imager is used as an example to develop research on the fault mechanism and structure improvement design.The finite-element model of the infrared thermal imager is modified based on the dynamic test.The fault mechanism is deduced by combining the finite-element method and the fatigue failure theory under random vibration.According to the analysis results,the structure was improved and verified using the fatigue failure theory and random vibration test.The results indicate that the fault location is accurate and the structural improvement is effective.The analysis method proposed in this paper is expected to provide a reference for the fault location and structural improvement of a single sensor.