印制板图形电镀针孔产生的因素探究

Exploration of factors caused by pattern plating pinholes for PCB

在印制电路板制作电镀过程中,电镀针孔是图形电镀生产过程中产生的不良缺陷之一,此缺陷严重影响了板件的一次合格率。本文通过对针孔产生的原因进行系统分析,识别产生原因,并有效解决问题,为PCB电镀制程改善提供参考。

In the PCB electroplating production process,electroplating pinholes are one of the undesirable defects produced in the pattern electroplating production process.This defect seriously affects the first pass rate of the board.This article systematically analyzes the causes of pinholes,identifies the causes,and effectively solves the problems,so as to provide a reference for the improvement of PCB electroplating process.