摘要
化学镀镍金(ENIG)是印制电路板(PCB)制作过程中较为常见的表面处理方式,金缸中金浓度的稳定性为关键控制参数和指标,从而能严格控制产品镀金厚度,达到稳定生产品质并降低生产成本的目的。文章介绍X射线荧光光谱分析(X Ray Fluorescence,XRF)在测定PCB化学镀金工序金缸中镍金含量的应用。
ENIG is a common surface treatment method in the process of PCB production.The stability of gold concentration in the gold cylinder is the key control parameter and index,so that the thickness of gilding can be strictly controlled to stabilize the production quality and reduce the production cost.This paper introduces the application of X-ray Fluorescence spectroscopy(XRF)in the determination of nickel and gold content in the metal cylinder of the chemical gold-plating process of PCB.
作者
王建军
陈良
Wang Jianjun;Chen Liang
出处
《印制电路信息》
2022年第2期39-42,共4页
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