T/R组件一体化组装工艺技术

T/R integrated assembly technology

有源发射/接收组件可靠性的重要技术之一就是组装焊接,由于有源发射/接收组件具有高频率、高功率的特点,对组装焊接技术提出更苛刻的要求,对于一体化组装焊接技术的研究显得尤为重要。文章主要对有源发射/接收组件一体化组装焊接过程为研究对象。首先,针对常见焊接过程及风险提出了重要建议。其次,通过一体化焊接实验,实现器件、基板、管壳一次性焊接,基板、芯片、管壳之间焊接的空洞率大小会影响焊接可靠性及频率传输。因此,基板、芯片、管壳之间焊接的空洞率必须小而少,为减少空洞率提出了真空焊接要求以及解决措施,并结合自己的实际工作,对有源发射/接收组件一体化组装工艺技术及注意事项作了相应的归纳和总结。最后,通过实际产品组装的最终状态以及各种实验结果,证明该工艺技术的可行性、可靠性。

One of the important technologies for Transmitter and Receiver(T/R)component reliability is the assembly welding,because T/R components have the characteristics of high frequency and high power,put forward more demanding requirements for the assembly welding technology,for the research of integrated assembly welding technology is particularly important.This paper mainly studies the welding process of T/R assembly.First,some important suggestions are put forward through common welding and process risks.Secondly,through the integrated welding experiment,the device,the substrate,the shell and tube one-time welding is realized.The void ratio of welding between substrate,chip and shell will affect welding reliability and frequency transmission.Therefore,the void rate of welding between substrate,chip and shell must be small and small.In order to reduce the void rate,the requirements and solutions of vacuum welding are put forward,and the integrated assembly technology of T/R module and matters needing attention are summarized and summarized according to my own practical work.