基于相控阵天线的大尺寸微波基板与连接器一体化精密装焊技术研究

Rsearch on intergrated precision welding technology of large-size microwave substrate and connector based on phased array manipulation

相控阵天线集成化、小型化的发展趋势要求其收发组件具备更高系统的集成度、更小的成本及体积。收发组件中功率分配与合成网络的小型化需要微波基板电路与机壳大面积接地互联,并使用规格更小的SMP连接器,实现电气连接和信号传输。针对某型号相控阵天线收发组件,使用的尺寸为145 mm×160 mm的RO4350B微波基板和39个SMP连接器焊接至铝镀银机壳上工艺进行研究。通过分析工艺指标难点,对基板焊接、SMP连接器焊接以及组合后一体化焊接中的各难点研究并给出相应措施,解决了焊接工艺中存在的空洞率、装焊精度、温度传输等问题,成功将基板与连接器进行一体化精密焊接,使基板与SMP连接器焊接指标均满足要求,有效焊接面积均可达85%,SMP连接器孔缝表面均填满95%以上,同轴度偏差<0.05 mm,且平面度落差<0.05 mm,装配精度和质量满足型号需求。

The development trend of integrated and miniaturized phased array antennas to have higher system integration degree and lower cost and volume.The miniaturization of power distribution and synthesis networks in transceiver modules requires a large area of ground interconnection between microwave substrate circuits and housing,and signal transmission.In this paper,the welding process of RO4350B microwave substrate with the size of 145 mm x160 mm and 39 SMP connectors used in a phased array antenna transceiving and receiving and receiving module module to the aluminum silver-plated chassis is studied.Through the analysis of the difficulty of the process indicators,the difficulties in substrate welding,SMP connector welding and integrated welding after assembly are studied and corresponding measures are given to solve the problems of void rate,assembly welding accuracy,temperature transmission and other problems in the welding process.The substrate and the connector are successfully integrated and precisely welded,so that the welding indicators of the substrate and the SMP connector meet the requirements,and the effective area can reach 85%.The surface of the SMP connector hole is filled with more than 95%,and the coaxiality deviation is<0.05 mm,and the flatness drop is<0.05 mm,the assembly accuracy and quality meet the requirements of the model.