单晶硅微尺度侧磨削边缘崩裂影响因素试验研究

Experimental study on influencing factors of edge crack in micro scale side grinding of single crystal silicon

为提高单晶硅材料微细加工过程中表面质量和单晶硅零部件的使用寿命,采用直径为0.9 mm、电镀500#金刚石磨粒的微磨棒沿单晶硅(100)晶面进行三因素五水平微尺度侧磨削试验。首先,通过极差分析和灰色关联分析,研究了磨削参数影响单晶硅边缘崩裂的主次因素;其次,优化出获得较低边缘崩裂长度值的加工参数组合;最后,通过单因素试验研究了单晶硅边缘崩裂长度值随磨削参数的变化规律。结果表明:磨削参数对边缘崩裂长度值影响顺序依次为进给速度、磨削深度、主轴转速;当主轴转速v_(s)=40000 r/min、进给速度v_(w)=20μm/s、磨削深度a_(p)=3μm时,边缘崩裂长度值最低;边缘崩裂长度值随主轴转速增大呈现先下降后上升的趋势,随进给速度和磨削深度的增大而增大。

To improve the surface quality of single crystal silicon in the process of micro machining and improve the service life of single crystal silicon parts.Orthogonal experiments of three factors and five levels on zirconia ceramics were performed using a micro-grinding tool with electroplated500#diamond abrasive and 0.9 mm diameter.Through range analysis and grey relational analysis,the influence of process parameters on edge crack of single crystal silicon was studied.Then,the microgrinding process was optimized to obtain minimum edge crack.Lastly,the effect of process parameters on the edge crack of micro-grinding single crystal silicon was analyzed through singlefactor experiment.The results show that the major and minor order of the effect of various process parameters on edge crack is the feed rate,the grinding depth and the feed speed.The optimized parameters combination was as follows:the feed speed v_(s)=40000 r/min,the feed rate v_(w)=20μm/s and the grinding depthα_(p)=3μm,being minimum.The edge crack decreases first and then increases with the increase of spindle speed,and increases with the increase of feed speed and grinding depth.