芯片表面硅油粘污处理研究

Study on the Treatment of Silicon Oil on Contaminated Chip Surface

针对芯片表面多余物粘污导致的稳定性和可靠性下降甚至器件失效的问题,对芯片表面典型的表面粘污多余物——硅油展开研究。选取两种型号粘污芯片作为案例,尝试设计一种用以去除芯片表面硅油粘污的清洗方法。使用特定型号UV膜固定芯片,配合有机溶剂异丙醇,使用超声波方法清洗。通过对比实验,确定出去污效果最佳时的超声波功率、频率及清洗时间。实验表明用此方法清洗可确保芯片性能及组装可靠性不受影响。

In order to solve the problem that the stability and reliability of the chip surface will decrease and even the device will fail due to the adhesion of the foreign matter on the chip surface,silicone oil, a typical adhesive on the chip surface, is studied. Taking two types of stained chips as examples, an attempt is made to design a cleaning method to remove silicone oil stain on the chip surface. The chips are fixed with a specific type of UV film, and cleaned by ultrasonic with isopropyl alcohol as organic solvent. Through comparative experiments, the ultrasonic power, frequency and cleaning time with the best decontamination effect are determined. Experiments show that the method can ensure that the chip performance and assembly reliability are not affected.