均温板传热性能实验研究

Experimental Study on Heat Transfer Performance of Vapor Chamber

本实验研究了由铜柱作为支撑结构且50%铜柱套有烧结铜粉片作为吸液芯的均温板的传热性能。实验中采用铸铝板模拟电子发热元件,通过调整直流电源的电压,在1.6~21 W/cm^(2)范围内改变加热散热元件的热流密度,分别测试了相同散热面积的均温板与纯铜板的散热效果。研究结果表明,当加热功率达到170 W时,均温板蒸发面热源中心点处的温度接近356 K,而相同条件下散热面积相同的纯铜板的中心温度达386 K。通过与纯铜板传热性能对比分析表明,在相同加热条件下,均温板的热阻及均温性均优于同尺寸的纯铜板。

In this paper, the heat transfer performance of a thermostatic plate with copper column as support structure and 50% copper column with sintered copper powder as suction core have been experimentally studied. In the experiment, the cast aluminum plate was used to simulate the electronic heating element. By adjusting the voltage of the DC power supply, the heat flux of the heating and cooling element was changed in the range of 1.6 ~ 21 W/cm^(2). The heat dissipation effect of the uniform temperature plate and pure copper plate with the same heat dissipation area were tested respectively. The results show that when the heating power reaches 170 W, the temperature at the center of heat source on the evaporative surface of homogenizing plate is close to 356 K, while the temperature at the center of pure copper plate with the same heat dissipation area is 386 K under the same conditions. Compared with the pure copper plate, heat transfer performance shows that under the same heating conditions, thermal resistance and temperature homogeneity of the plate are better than the same size of the pure copper plate, the larger heating area of the homogeneity plate is, the smaller thermal resistance of the homogeneity plate has.