低共熔溶剂中Ni-Co合金电沉积的工艺研究

Study on Electrodeposition of Ni-Co Alloy in Eutectic Solvent

在摩尔比为1∶2的氯化胆碱-尿素(ChCl-Urea)低共熔溶剂中,在纯铜基体表面制备Ni-Co合金镀层。分别研究沉积温度、沉积电位、主盐浓度比三种因素对Ni-Co合金沉积镀层的影响,通过观察镀层的微观形貌,并利用极化曲线对Ni-Co合金镀层的耐蚀性进行分析,确定ChCl-Urea-NiCl_(2)·6H_(2)O-CoCl_(2)·6H_(2)O体系中最佳沉积条件为:沉积电位为-1.00V,镍盐与钴盐的摩尔浓度比为5∶1,沉积温度为70℃,沉积时间为30min。制备的镀层均匀致密,具有良好的耐蚀性。

Ni-Co alloy coating was prepared on the surface of pure copper substrate in choline chloride-urea(ChCl-Urea)eutectic solvent with a molar ratio of 1∶2.The effects of deposition temperature,deposition potential and concentration ratio of main salt on Ni-Co alloy coating were studied respectively.The corrosion resistance of Ni-Co alloy coating was analyzed by observing the micro-morphology of the coating and using polarization curve.The optimum deposition conditions in(ChCl-Urea-NiCl_(2)·6H_(2)O-CoCl_(2)·6H_(2)O)system is as follows:deposition potential is-1.00 V,the molar concentration ratio of nickel salt to cobalt salt is 5∶1,the deposition temperature is 70℃,the depositiontime is 30 min.The coating is arranged densely on the surface of the substrate with uniform distribution and good corrosion resistance.The prepared coating is uniform and compact with good corrosion resistance.