铜导线短路熔痕中共晶体的定量金相研究

Quantitative analysis of the metallographic of Cu+Cu;O eutectic in copper wire short circuit molten beads

通过模拟短路条件制备铜导线短路熔痕,对短路熔痕中共晶体进行了金相分析和定量研究。研究发现,铜导线一、二次短路熔痕共晶体组织特征具有一定区别,短路喷溅熔珠中共晶体含量分别为15.28%、5.10%,远远超过同短路类型线端熔痕中0.33%、0.19%的共晶体含量。通过对比短路熔痕中共晶体微观组织与含量大小,可以鉴别铜导线短路熔痕种类,其中喷溅熔痕的特征较明显。

The molten beads of copper wire is prepared by simulated short circuit, and the metallographic phase and quantitative analysis of Cu+Cu;O eutectic is studied. It is found that the metallographic phase of Cu+Cu;O eutectic is different in primary and second molten beads. The content of Cu + Cu;O eutectic in primary spatter molten beads is 15.28%, where it is 5.10% in second spatter molten beads. But the content of the primary molten beads on wire is 0.33%, and 0.19% in second molten bead on wire. The short circuit molten bead can be distinguished by the metallographic phase and content of eutectic, and it is more evidently in spatter molten beads.