轨道交通绝缘栅双极型晶体管模块封装材料的制备技术及其显微组织研究

Preparation Technology and Microstructure of IGBT Module Packaging Materials for Rail Transit

作为电气系统组件,IGBT(绝缘栅双极型晶体管)模块在轨道交通领域有着广泛应用。封装材料的性能直接影响IGBT模块的使用寿命和稳定性。Al-50%Si合金是IGBT模块较为理想的封装材料。采用粉末冶金结合双向分级热压致密化成型工艺,制备了Al-50%Si合金材料。使用OM、SEM方法(扫描电子显微镜)分析热压态及热处理态合金的显微组织。结果表明,在烧结温度为720℃且保温50 min后,能够获得Si相尺寸与分布控制较好的合金;在热扩散温度为540℃,扩散处理3.5 h后,能够有效熔断纤维状与细针状共晶硅。

As an electrical system component,IGBT(insulated gate bipolar transistor)module is widely used in the field of rail transit.The properties of packaging materials directly affect the service life and stability of IGBT module,and the Al-50%Si alloy is an ideal packaging material for IGBT module.Using powder metallurgy combined with bidirectional classification hot pressing and densification forming process,the Al-50%si alloy is prepared.Then,OM(optical microscopy)and SEM(scanning electron microscope)are employed to analyze the microstructure of hot pressed and heat treated state alloy.Results show that after heat insulation for 50 min at 720℃.,the alloy with good Si size and distribution control will be obtained.When the thermal diffusion temperature is 540℃.and for 3.5 hours of diffusion treatment,the fibrous and fine needle-shaped eutectic silicon can be effectively fused.