基于改进模拟退火算法的PCB电子元器件热优化布置研究

Research on thermal optimization layout of PCB electronic components based on improved simulated annealing algorithm

为了解决PCB板上电子元器件温度过高的问题,文中基于模拟退火算法介绍了一种PCB电子元器件优化布置的方法。该方法在传统优化方法的基础上进行改进,依次对二维阵列式布置模型和元器件选位进行优化。文中对该方法的建模及优化过程进行分析,并给出了具体的优化案例。通过在热仿真软件Icepak平台将该方法与传统优化方法进行对比,对于文中所选案例,该方法相比传统方法优化了3.09℃,优化率达到8.95%,仿真结果证明了该方法的可行性。

In order to solve the problem that the temperature of electronic components on PCB is too high,an optimal layout method of electronic components on PCB is proposed based on simulated annealing algorithm. This method is improved on the basis of traditional optimization method,which optimizes the two-dimensional array layout model and component location in turn. This paper analyzes the modeling and optimization process of this method,and gives a specific optimization case. By comparing this method with the traditional optimization method in the thermal simulation software Icepak platform,for the selected cases,this method has 3.09 ℃ optimization compared with the traditional method,and the optimization rate reaches 8.95%. The simulation results prove the feasibility of this method.