飞秒激光制备柔性电子器件进展

Advance in femtosecond laser fabrication of flexible electronics

消费电子市场正推动柔性电子器件向集成化、小型化及可穿戴的方向发展,同时也对柔性电子器件的制备提出了新的要求。光刻工艺加工精度高,但其成本昂贵、加工流程复杂且效率低。相比而言,飞秒激光加工兼有加工精度高和工艺流程简单的特点,已展现在制备柔性电子器件方面的独特优势和应用前景。为了更好地了解这一新兴领域的进展,本文概述了与柔性电子器件制备相关的五种飞秒激光加工工艺机理,包括激光液相纳米材料合成、激光纳米材料还原、激光诱导纳米连接、激光电极图案化及激光表面织构化,并介绍了制备的典型柔性电子器件性能,对存在的问题和未来发展趋势进行了分析和展望。

Consumer electronical markets are now promoting a rapid advance in flexible electronics with high integration,miniaturization,and wearable properties,which in turn puts forward new requirements for the fabrication of flexible electronics.Photolithography techniques are advantageous for their high accuracy,but it is disadvantageous due to high cost,complexity,and low efficiency.In comparison,femtosecond(fs)laser micro-nano fabrication,as a high-efficiency and simple technique,has shown its capacity and potential for the fabrication of flexible electronics.This review summarizes five fs-laser based techniques for the fabrication of flexible electronics,including laser synthesis of nanomaterials in liquids,laser-induced nanomaterial chemical-reduction,laser-induced nano joining,laser electrode patterning,and laser surface texturing.The corresponding mechanisms are briefly introduced,followed by a demonstration of typical flexible electronics and their properties.Finally,the challenges in this field are analyzed,and our perspective is provided.