直流断路器触头系统温度场仿真分析

Simulation analysis of temperature field of DC circuit breaker contact system

温升是断路器设计的重要考核指标之一,严重时会使断路器的使用寿命降低甚至影响周边设备。本文以某型直流断路器为研究对象,基于有限元分析热电耦合法对其主回路进行了温度场仿真计算。仿真结果与温升试验结果基本一致。此后,探讨了在总接触电阻一定情况下,主、弧双档触头的接触电阻占比分布对该断路器温升分布的影响,得出断路器在主、弧触头接触电阻最优占比下温升分布,对相似结构断路器的触头系统研究具有一定的参考意义。

Temperature rise is one of the important assessment indicators for circuit breaker design,and the excessive temperature rise will reduce the service life of the circuit breaker and even affect the other equipment surrounding.In this paper,the temperature field calculations of a certain DC circuit breaker are made by the thermoelectric coupling method of finite element analysis,which basically agrees with the temperature rise test results.Then,this paper discusses the influence of the proportion distribution of the main and arc double-gear contacts on the temperature rise distribution of the circuit breaker under the condition of a certain total contact resistance.Then we got the temperature rise distribution of the circuit breaker under the optimal proportion of the contact resistance of the main and arc contacts,which has a certain reference significance for the research of the contact system of the circuit breaker with similar structure.