新型半芳香共聚酰胺PA10T/10Py的制备及性能表征

Preparation and Characterization of Novel Semi Aromatic Copolyamide PA10T/10Py

采用两种结构相近的半芳香酰胺对苯二甲酰癸二胺(10T)和2,5吡啶二甲酰癸二胺(10Py)盐,通过成盐、预聚合、固相后聚合“三步法”制得一种新型半芳香共聚酰胺PA10T/10Py,采用相对黏度、傅立叶变换红外吸收光谱仪(FTIR)、差示扫描量热仪(DSC)、热重分析仪(TG)和X射线衍射仪(XRD)等表征手段对其结构性能进行分析。结果表明,共聚酰胺中酰胺键的红外吸收峰峰位相比于均聚半芳香聚酰胺PA10T变高。PA10Py的加入降低了半芳香聚酰胺材料的熔点,并维持了较高的热分解温度,初始分解温度在390℃以上。同时也提高聚酰胺材料的机械性能,相比对不添加PA10Py的样品,拉伸强度可提高16%。吡啶环结构的定量加入为制备具有良好加工性能和机械性能的半芳香聚酰胺材料提供了一种新的技术路线。

Two semi-aromatic amides with similar structures,decamethylene terephthalamide(10T)and decamethylene 2,5-pyridine dicarbonamide(10Py)salt,were used to prepare a new type of semi-aromatic copolyamide PA10T/10Py through the"three-step method"of salt formation,pre-polymerization,and solid-phase post-polymerization.Its structural properties were analyzed by relative viscosity,Fourier transform infrared spectrometer,differential scanning calorimetry,thermal gravimetric analyzer,X-ray diffraction,and so on.The results show that the infrared absorption peak position of the amide bond in the copolyamide is higher than that of the homopolymer semi-aromatic polyamide PA10T.The addition of PA10Py could reduce the melting point of the semi-aromatic polyamide material and maintain a higher thermal decomposition temperature.The initial decomposition temperature is above 390℃.It also improves the mechanical properties of the polyamide material.Comparing with the sample without PA10Py,the tensile strength could increase 16%.The quantitative addition of pyridine ring structure provides a new technical route for preparing semi-aromatic polyamide materials with good processing and mechanical properties.