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Cu-Sn合金上引连铸凝固组织数值模拟 被引量:2

Numerical Simulation of Solidification Structure of Cu-Sn Alloy Upward Continuous Casting
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摘要 分析了直径8 mm的Cu-0.3%Sn合金铸锭在上引连续铸造过程中的凝固行为。以微观-宏观耦合为基准,采用MiLE法和CA-FE法分别模拟了温度场变化及晶粒生长演变过程。系统地研究不同铸造温度(1150、1200、1250℃)及不同铸造速度(1、3、5 mm/s)对Cu-0.3Sn合金在上引连铸凝固过程中固/液界面形状、液穴深度及晶粒的影响规律。模拟结果与实验结果一致,并验证了仿真模拟的准确性。 In this paper,the solidification behavior of Cu-0.3wt.%Sn alloy ingot with diameter of 8 mm during upward continuous casting is analyzed.Based on the microscopic and macroscopic coupling,the mile method and the CA-FE method are used to simulate the temperature field change and the grain growth evolution process respectively.The influence law of different casting temperatures(T=1150,1200,1250℃)and different casting speeds(v=1,3,5 mm/s)on the shape of the solid/liquid interface,liquid cavity depth and grain morphology have been systematically studied during the upward continuous casting process.The simulation results are consistent with the experimental results,and verify the accuracy of the simulation,which provides theoretical guidance for the optimization of alloy casting process.
作者 杨庆宝 王兰浩 曾浩 袁大伟 汪航 杨斌 YANG Qingbao;WANG Lanhao;ZENG Hao;YUAN Dawei;WANG Hang;YANG Bin(Faculty of Materials Metallurgy and Chemistry,Jiangxi University of Science and Technology,Ganzhou 341001,China)
出处 《铸造技术》 CAS 2022年第2期123-130,共8页 Foundry Technology
基金 国家重点研发计划项目(2016YFB0301400)。
关键词 Cu-Sn合金 凝固模拟 CA-FE法 固/液界面 晶粒组织 Cu-Sn alloy solidification simulation CA-FE method S/L interface grain structure
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