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红外相机三态隔热冷却装置的设计及分析

Design and Analysis of Three-state Thermal Insulation Cooling Device for Infrared Camera
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摘要 红外相机工作环境温度不能超过50℃,但在某些工业高温场合,它需在约300℃的环境中持续工作。针对此问题,设计一种适用于某型号红外相机的三态隔热冷却装置。该装置结合隔热材料阻滞热量传递、水冷却、空气冷却的三态物质的隔热冷却效果,同时具有自清洁石英玻璃的作用。通过COMSOL中的传热模块对传热性能进行验证,分析其内部空间的温度场。结果表明:所设计的三态隔热冷却装置能够在约300℃的环境温度下使红外相机所处空间的温度保持在50℃以下,保证红外相机能正常工作。 Infrared camera working environment temperature cannot exceed 50℃,but in some industrial high temperature occa⁃sion,it needs to continue to work at about 300℃environment.Aiming at this problem,a three-state heat insulation cooling device for a certain type of infrared camera was designed.The device had the three-state matter thermal insulation cooling effect including the heat insulation block transmission,water cooling,air cooling heat cooling,at the same time,it had the function of self-cleaning quartz glass.The heat transfer performance was verified through the heat transfer module in COMSOL,and the temperature field in the inter⁃nal space was analyzed.The results show that by using the designed three-state heat insulation cooling device,the temperature of the infrared camera can be kept below 50℃under the ambient temperature about 300℃,and the normal operation of the infrared camera can been sured.
作者 王栋栋 刘复兴 张荣 杨金堂 WANG Dongdong;LIU Fuxing;ZHANG Rong;YANG Jintang(Key Laboratory of Metallurgical Equipment and Control,Ministry of Education,Wuhan University of Science and Technology,Wuhan Hubei 430081,China;Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering,Wuhan University of Science and Technology,Wuhan Hubei 430081,China;Steelmaking Plant,Baowu Group Echeng Iron and Steel Co.,Ltd.,Ezhou Hubei 436099,China;School of Mechanical and Electrical Engineering,Wuhan Donghu University,Wuhan Hubei 430212,China)
出处 《机床与液压》 北大核心 2022年第5期80-85,共6页 Machine Tool & Hydraulics
基金 国家重点专项资助项目(2018YFC1902400) 国家自然科学基金项目(51805386)。
关键词 三态隔热冷却装置 传热数值分析 温度场 Three-state thermal insulation cooling device Numerical analysis of heat transfer Temperature field
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  • 1丘成悌,赵悖殳.电子设备结构设计原理[M].南京:东南大学出版社,2001.
  • 2Radmehr A, Kelkar K M, Kelly P, et al. Analysis of the Effect of Bypass on the Performance of Heat Sinks Using Flow Network Modeling(FNM) [C]//Proc of the 15th Annual IEEE on Semiconductor Thermal Measurement and Management Syrup, 1999 : 42-47.
  • 3Maeroflow Users Manual[R]. Innovative Research, Inc. MN55447.
  • 4Tummala R R. Fundamentals of Microsystems Packaging [M]. New York : McGraw-Hill, 2001.
  • 5宜兴市空调设备厂.改良的板式空气热交换器[P].中国:专利号ZL03277535.0,实用新型,2003-08.
  • 6张平.一种新型换热器[P].中国:申请号200510040335.7,发明专利,2005,06.
  • 7Ellison G N. Thermal Computations for Electronic Equipment[M]. Florida:Robert E. Krieger Publishing Co. Malibar, 1989.
  • 8Belady C, Kelkar K M, Patankar S V. Improving Productivity in Electronics Packaging with Flow Network Modeling (FNM) [J]. Electronics Cooling, 1998,5 (1) : 36-40.
  • 9Steinbrecher R,Radmehr A, Kelkar K M. Use of Flow Network Modeling(FNM) for the Design of Air-Cooled Servers [C]//Proc of the Pacific RIM/ASME Intersociety Electronics an Photonic Packaging Conference, 1999 : 1999-2008.
  • 10Kowalski T,Radmehr A. Thermal Analysis of an Electronics Enclosure: Coupling Flow Network Modeling (FNM) and Computational Fluid Dynamics (CFD)[C]//Proc of the Semiconductor Thermal Measurement and Management Symposium, 2000:60-67.

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