SnO_(2)增强相对AgCuOIn_(2)O_(3)电触头材料显微组织与性能的影响

Effect of SnO_(2) Reinforcement Phase on Microstructure and Properties of AgCuOIn_(2)O_(3)Electrical Contact Materials

采用反应合成法结合塑性变形工艺制备了不同SnO_(2)含量的AgCuOIn_(2)O_(3)SnO_(2)电触头材料,利用扫描电镜和金相显微镜表征了材料的微观形貌及显微组织,分析对比了不同SnO_(2)含量的材料金相组织及其增强相的分布均匀性,并利用X射线衍射分析了材料的物相结构。测量了材料的抗拉伸强度、硬度、电阻等性能。结果表明:添加适量的SnO_(2)能使组织中的孔隙尺寸缩小、其他缺陷明显减少。氧化物弥散分布在银基体中,极大地改善了AgCuOIn_(2)O_(3)电触头材料的显微组织均匀性。在SnO_(2)含量不变时,材料的电阻率随塑性变形程度增加而有所降低;随着SnO_(2)含量增多,电阻率呈现先降低后升高的趋势,最后趋于定值,约为2.4μΩ·cm。添加SnO_(2)后各试样材料的硬度均显著升高,SnO_(2)含量为1%(质量分数)的材料具有最优的抗拉伸强度和延伸率。

AgCuOIn_(2)O_(3)SnO_(2) electrical contact materials with different SnO_(2) contents were prepared by reaction synthesis coupled with plastic deformation process.The morphology and microstructure of the AgCuOIn_(2)O_(3)SnO_(2) contact materials were characterized by scanning electron microscopy and optical microscope.The distribution uniformity of the metallographic structure and the reinforcement phase of the materials with different SnO_(2) contents was analyzed.The phase structure of the materials was measured by X-ray diffraction,and the tensile strength,hardness,and resistivity of the materials were also measured.Results show that the appropriate SnO_(2) addition can significantly decrease the pore size and reduce other defects in the structures.The diffusion of oxides in the silver matrix greatly improves the microstructure uniformity of AgCuOIn_(2)O_(3) contact materials.When the SnO_(2) content is fixed,the resistivity of materials is decreased with conducting the plastic deformation;with increasing the SnO_(2) content,the resistivity is decreased firstly,then increased,and finally turns to be stable at 2.4μΩ·cm.The hardness of the materials is increased significantly after SnO_(2) addition.The material with 1wt%SnO_(2) shows the optimal tensile strength and elongation.