磁控溅射WCu抗菌薄膜的结构与性能

Structure and Properties of Magnetron Sputtered WCu Antibacterial Films

采用磁控溅射技术在载玻片上制备了钨铜薄膜,研究了薄膜的结构与性能。结果表明,薄膜的沉积速率和铜含量随铜靶电流的增大而升高,晶粒尺寸和显微硬度随铜靶电流的增大而下降。钨铜薄膜形成了固溶体,在铜含量较高时也有铜颗粒析出。WCu薄膜具有较高的疏水性,薄膜润湿性、液滴尺寸和环境温湿度都影响水滴和水膜的干燥时间。平板计数和菌液喷雾抗菌实验表明,WCu薄膜对大肠杆菌具有良好的抗菌作用。WCu薄膜有望用于环境设施的抗微生物表面改性。

Tungsten-copper films were prepared on slide glass by magnetron sputtering and the structure and properties of the films were studied. The results show that with the increase of copper target current, the deposition rate and copper content of the film increase, while grain size and microhardness of the film decrease. Solid solution is formed for the WCu films and Cu particles are segregated at high Cu content. WCu films have high hydrophobicity and film wettability, droplet size and ambient temperature/humidity all affect the drying time of water droplet and water film. The antibacterial tests by plate counting and spraying of bacterial suspension show that WCu films have good antibacterial activity against E. coli. WCu films are expected to be used in antimicrobial surface modification of environmental facilities.