SiC陶瓷磨削机理与表面质量研究

Study on Grinding Mechanism and Surface Quality of SiC Ceramics

为了研究SiC陶瓷在磨削过程中的去除机理和表面质量,设计了SiC陶瓷的平面磨削试验。采用电镀金刚石砂轮完成单因素和正交试验,通过对试验结果进行极差分析,考察了不同磨削参数对表面质量的影响规律,并进一步分析了材料的去除机理。实验结果表明,随着磨削深度a_(p)和进给速度v_(w)的增大,表面粗糙度呈现增大的趋势,材料表面平整度下降,表面质量降低;砂轮转速n_(s)增加时,表面粗糙度减小,缺陷区域减少,表面质量提高;其中磨削深度对表面质量的影响最大,砂轮转速次之,进给速度对表面质量的影响最小;磨削加工过程中SiC材料去除主要为脆性断裂,同时还伴随着塑性变形。

In order to study the removal mechanism and surface quality of SiC ceramics in grinding process,surface grinding experiments of SiC ceramics were designed and carried out.The single factor and orthogonal experiments were carried out by electroplated diamond grinding wheel.The effect of different grinding parameters on surface quality was investigated by range analysis of the test results,and the mechanism of material removal was further analyzed.The experimental results show that with the increase of grinding depth a_(p) and feed rate v_(w),the surface roughness increases,the surface roughness decreases,and the surface quality decreases.When the grinding wheel speed n_(s) increases,the surface roughness decreases,the defect area decreases,and the surface quality improves.The grinding depth has the greatest influence on the surface quality,followed by the spindle speed,and the feed speed has the least influence on the surface quality.During the grinding process,the removal of SiC material is mainly caused by brittle fracture,accompanied by plastic deformation.