新型电子产品用Al-Zn-Mg合金热变形行为与热加工图研究

Research on Hot Deformation Behavior and Hot Working Map of Al-Zn-Mg Alloy Used in New Electronic Products

通过热模拟实验和热加工图,研究电子产品用新型Al-Zn-Mg合金在变形温度380℃-540℃和应变速率0.01-10s^(-1)条件下的热变形行为,确定了合适的热变形工艺范围。结果表明:新型Al-Zn-Mg合金热变形的峰值应力随着变形温度的升高而降低,随着应变速率增大而增大;而随着真应变的增大,失稳区逐渐增大,当真应变达到0.6时失稳区基本保持不变;合金适宜的热变形条件为变形温度420℃-500℃,应变速率0.01-0.4s^(-1)。

The thermal compression behavior of the new type Al-Zn-Mg alloy was studied on a thermal simulator machine.The hot deformation behavior of the alloy at temperature 380℃-540℃ and strain rate 0.01-10 s^(-1) was studied.The thermal processing map of the alloys were established.The results show that the peak stress of high temperature deformation of alloy decreases with the increase of deformation temperature and increases with the increase of strain rate.With the increase of the strain,the instability zone in the processing map increases gradually.When the true strain reaches 0.6,the instability zone remains basically unchanged.The suitable deformation condition of the alloy are temperature range from 420℃ to 500℃ and strain rate range from 0.01s^(-1)to 0.4s^(-1).