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Effect of copper nanoparticles on thermal behavior of two-phase argon-copper nanofluid flow in rough nanochannels with focusing on the interface properties and heat transfer using molecular dynamics simulation

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摘要 A comparison between the efficacy of surface boundary structure and presence of nanoparticles on the condensation two-phase flow inside rough nanochannels has been accomplished by applying molecular dynamics procedure to evaluate the thermal conductivity and flow characteristics.Simulation is performed in a computational region with two copper walls containing rectangular rough elements under different saturated temperatures.The main properties of liquid–vapor interface including density and the number of liquid atoms,are obtained.It is observed that the density profile is more affected by nanoparticles than the roughness.Also,compared to the condensation of nanofluid in a smooth nanochannel,the rough wall causes a greater drop in the temperature at the early time steps and by development of liquid films,effects of the wall roughness reduce.At the first of the condensation process,adding nanoparticle causes that transferring argon particles to the liquid phase increases with a steeper slope.Furthermore,heat current autocorrelation function(HCACF)for nanofluid condensation flow over considered correlation time is analyzed and following that the thermal conductivity for different saturated conditions is calculated.It has been represented that at lower temperatures the roughness makes more significant influence on the heat transfer of two-phase flow,while at higher temperatures the importance of nanoparticles prevails.
出处 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2022年第2期344-350,共7页 中国化学工程学报(英文版)
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