摘要
电子设备在工作时会产生热量,影响电子设备的可靠性。本文采用Icepak软件对某型地面电子设备强迫风冷结构进行仿真分析,对影响散热器散热效率的翅片形式、翅片厚度、供风方向三种因素进行了讨论。得出分段式翅片结构在一定范围内并不能增强散热器散热效率,本文所研究的散热器结构采用抽风形式时具有更好的散热效率,翅片厚度宜采用1 mm。
Electronic equipment generates heat when it is working,which affects the reliability of electronic equipment.In this paper,the forced air cooling structure of a ground electronic equipment is simulated and analyzed by Icepak software.Three factors affecting the heat dissipation efficiency of the radiator,including fin structure,fin thickness and air supply direction,are discussed.It is concluded that the segmented fin structure cannot enhance the heat dissipation efficiency of the radiator within a certain range.The studied radiator structure has better heat dissipation efficiency when using the exhaust mode,and the fin thickness should be 1 mm.
作者
孙飞
SUN Fei(Tenth Research Institute of China Electronics Technology Group Corporation,Chengdu 610036)
出处
《环境技术》
2022年第1期142-146,共5页
Environmental Technology
关键词
电子设备
强迫风冷
Icepak
仿真模拟
热阻
electronic equipment
forced air cooling
Icepak
simulation
thermal resistance