摘要
In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confirmed that the formation and the corrosion of Mg_(2)Sn nanoparticles were the dominant reason of Sn whisker growth.The Mg_(2)Sn accumulation at the grain boundaries would pin the dislocation slip and affect the continuity of whisker growth,and the boundary angle would thus play a decisive role in the growth shape of Sn whiskers due to the pining effect of Mg_(2)Sn.This study might be conducive to elucidating the growth behavior of Sn whiskers and provide the exploration strategy to further improve the bonding strength of Mg/Sn/Mg ultrasonic-assisted soldering joints.
作者
Cao Huijun
Li shiqin
Zhang Yinggan
Zhu Yichen
Li Mingyu
Zhang Zhihao
操慧珺;李世钦;张英干;朱轶辰;李明雨;张志昊(College of Materials,Xiamen University,Xiamen 361000,China;Shenzhen Research Institute,Xiamen University,Shenzhen 518055,China;School of Transportation Engineering,Xiamen City University,Xiamen 361005,China;Sauvage Laboratory for Smart Materials,School of Materials Science and Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China)
基金
supported by Science and Technology Planning Project of Shenzhen (Grant No. JCYJ201908 09161213154)
Xiamen Youth Innovation Fund Project (Grant No. 3502Z20206026)
Academy-level Project of Xiamen City University (Grant No.KYKJ2019-4)。
