摘要
In this work,the sandwich joints were joined by low temperature pressureless sintering Ag paste.The morphology and thermal behavior of Ag nanoparticle paste was characterized and analyzed.The sintered Ag joints with different metallization were prepared and tested.The joints with Ag metallization exhibited superior shear strength and interface bonding ratio.However,the joints with Cu metallization showed lowest shear strength and interface delamination.The interfacial microstructures were observed and the diffusion kinetics between Ag and Au atoms were both calculated.The excessive diffusion of Ag atoms towards the Au layer deteriorated the interface bonding ratio and shear strength.This work will help understand the bonding mechanism between sintered Ag and other metallization.
作者
Yang Fan
Wu Weizhen
Du Jianjun
Li Mingyu
杨帆;吴炜祯;杜建军;李明雨(School of Mechanical Engineering and Automation,Harbin Institute of Technology Shenzhen,Shenzhen 518055,China;Sauvage Laboratory for Smart Materials,School of Materials Science and Engineering,Harbin Institute of Technology Shenzhen,Shenzhen 518055,China)
基金
supported by the Shenzhen Science and Technology innovation committee (Grant No. JCYJ.0180306172006392)。
