基于ANSYS的挠性基板叠装互联组件热分析

Thermal analysis of flexible substrate stack interconnection components under different chip layout conditions

长期使用环境中交变温度载荷引起的结构热疲劳会显著影响挠性基板叠装互联组件的结构强度和使用寿命。以挠性基板叠装互联组件为研究对象,基于ANSYS软件参数化建模方法建立了挠性基板叠装互联组件三维有限元模型,针对互联组件六种内部芯片布局方案进行了互联结构热特性分析并进行对比。然后基于正交试验方法分析了多种影响因素对互联组件热特性的影响,经对比得到了互联组件最优芯片布局方案及互联组件热特性影响因素的权重。研究结果表明,所分析互联组件热特性影响因素中,灌封胶热导率影响最显著,权重占49.71%;空气对流系数及灌封胶厚度影响较为显著,权重占比分别为29.01%和15.83%,基板热导率影响最小,并给出了互联组件热特性影响因素最佳参数组合。

The structural strength and service life of a flexible substrate stacked interconnection component can be heavily affected by structural and thermal fatigue,which occurs due to the alternating temperature loads in long service environment.To investigate the flexible substrate stacked interconnect components,a 3 D finite element model was established using the ANSYS software,and thermal characteristics of interconnected structures were analyzed and compared for six internal chip layout schemes.After that,multiple affecting factors on the thermal characteristics of the interconnected components was analyzed using orthogonal experiment method.By screening,the optimal chip layout scheme and the weights of each affecting factors on the thermal characteristics of the interconnected components were determined.Research results show that,among the affecting factors,the thermal conductivity of the potting compound can mostly affect the thermal characteristics,accounting for 49.71%weight.The air convection coefficient and the thickness of the potting compound are the next significant factors,accounting for 29.01%and 15.83%respectively.The substrate thermal conductivity is the least affecting factor.The optimal parameters were finally determined by comparison to obtain the best thermal characteristics of the interconnected components.