智能移动通信终端用PCB叠层设计的一些思考

Some thoughts on stack layer design of PCB for the intelligent mobile communication

随着智能移动通信产业对PCB的要求也在不断提升,PCB行业的发展也面临新的挑战。文章将简要介绍在智能移动通信产业技术快速发展的背景下,对智能移动通信PCB叠层设计特点及选材、工艺匹配性等做了初步思考阐释.

With the intelligent mobile communication industry constantly improving requirements for PCB,the development of PCB industry also faces new challenges.This article will briefly introduce the notice and importance of PCB stack layer design under the background of the rapid development of intelligent mobile communication technology.