刚挠印制电路板的参考层设计对阻抗值稳定性的影响研究

Research on the influence of reference layer design on impedance value stability for Rigid-Flex PCB

随着PCB技术飞速发展,对阻抗的管控要求日益严格。部分刚挠性板/挠性板产品因叠构/板厚限制,必须通过阻抗参考层设计网格铜达成阻抗值目标。网格铜角度通常设计为45°,阻抗模拟软件SI9000也仅支持该角度的模拟。文章主要探究其他阻抗影响因子一致时,不同网格铜角度、位置,对应实测的阻抗值及稳定性分析。

With the rapidly development of PCB,the requirement for impedance control become increasingly stringent.The impedance reference of some rigid-flex and flex productions must design mesh copper to match the impedance value requirement,which is limited by structure and thickness.The angle of mesh copper generally design is 45°,which is only supported by impedance simulation software SI9000.This paper mainly explores actual impedance value and stability of different mesh copper angle and location,when other impedance influence factors remain unchanged.