一种无卤、高T_(g)覆铜板的制备及其性能研究

Preparation and properties of a Copper Clad Laminate with halogen-free and high T_(g)

随着环保要求越来越严格,覆铜板无卤化已成趋势。本研究采用DOPO型环氧树脂与邻甲酚醛环氧树脂作为主体树脂,双氰胺作为固化剂,咪唑作为固化促进剂,氢氧化铝和滑石粉作为填充剂。通过对氢氧化铝和滑石粉表面处理以及粒径控制,使填充剂均匀分散到树脂胶液及玻纤布中,改善了板材韧性。本研究制备的覆铜板,除基本性能满足IPC-4101国际标准外,其卤素总含量为ND(未检出),玻璃化转变温度(T_(g)值)>180℃,耐热分解时间(T288)>120 min。

With the increasingly stringent requirements for environmental protection,the halogen-free copper clad laminate has become a trend.DOPO epoxy resin and o-cresol epoxy resin are used as the main resin,dicyandiamide as the curing agent,imidazole as the curing accelerator,aluminum hydroxide and talc powder as the filler.Through the surface treatment and particle size control of aluminum hydroxide and talc powder,the filler is evenly dispersed into resin glue and glass fiber cloth,and the toughness of the plate is improved.Except that the basic properties of the copper clad laminate prepared in this study meet the IPC-4101 international standard,the total halogen content is ND,the glass transition temperature(TG value)is greater than 180℃,and the thermal decomposition time(T288)is greater than 120 minutes.