氧化铝陶瓷表面高度分布状态随抛光时间的变化规律与机理研究

Research on Changing Law and Generation Mechanism of Height Distribution with Polishing Time for Alumina Ceramics

利用化学机械抛光对氧化铝陶瓷进行加工,结合表面算术平均高度Sa和均方根高度Sq,研究偏斜度Ssk和陡度Sku随抛光时间的变化规律,分析光滑表面形成机理。结果表明:随着抛光时间的延长,Sa和Sq呈先快速下降后缓慢下降的规律;Ssk呈先下降后上升再波动的规律;Sku呈先上升后下降再上升的规律。塑性去除、晶粒断裂和晶粒脱落三种作用机理是表面高度分布变化的本质,其中塑性去除作用贯穿整个抛光过程,有利于形成光滑表面;而晶粒断裂和晶粒脱落则主要作用于较光滑表面,这也是Ssk和Sku在抛光后期呈波动变化的主要原因。

The surface of alumina ceramics was polished by chemical mechanical polishing process. Combined with the arithmetic mean height of Sa and root mean square height of Sq, the variation in Ssk(skewness) and Sku(kurtosis) with polishing time were analyzed to reveal the formation mechanism of smooth surface. The results show that Sa and Sq decrease rapidly first and then slowly with the polishing time increasing, while Ssk decreases first and then rises and then fluctuates, and Sku rises first and then falls and then rises. The three mechanisms of plastic removal, grain fracture and intergranular fracture are key factors that affected the surface state of alumina ceramics. The plastic removal affects the height distribution of the surface in the whole polishing process, which is beneficial to build smooth face. The grain fracture and intergranular fracture play an obvious impact on the height distribution, which are the main cause of fluctuation of Ssk and Sku at the later of polishing.