亚甲基紫对盲孔镀铜电化学行为和填孔效果的影响

Effect of methylene violet on electrochemical behavior of copper electroplating for blind via and filling effectiveness

以常见整平剂健那绿(JGB)为参照,研究了亚甲基紫(MV)对铜沉积的电化学行为和填盲孔效果的影响。电化学分析结果表明,在不含PEG的镀液中,MV和JGB均表现为加速铜沉积;加入PEG后,二者均表现为抑制铜沉积,并且JGB对铜沉积的速率控制步骤(Cu^(2+)+e^(−)→Cu^(+))的抑制作用强于MV。哈林槽电镀实验结果表明,以MV和JGB作为整平剂在相同的条件下电镀铜填盲孔时面铜的厚度相同,但采用MV时孔口处出现凸起,采用JGB时孔口则出现凹陷。微观结构分析表明,采用上述2种整平剂时所得铜镀层的择优取向均为(111)晶面,但以JGB作为整平剂时表面更平整。

The effect of methylene violet(MV)on electrochemical behavior of copper electrodeposition and filling effectiveness of blind via was studied using Janus green B(JGB)as reference.The electrochemical analysis results showed that both MV and JGB could accelerate the electrodeposition of copper in the electrolyte without polyethylene glycol(PEG 8000).However,they inhibited the electrodeposition of copper in the electrolyte containing PEG,and JGB had stronger inhibition efficiency on the rate-controlling step(Cu^(2+)+e^(−)→Cu^(+))of copper deposition than MV.The results of electroplating test in Harling cell under the same conditions showed that the copper coatings electroplated on the panel surface had the same thickness when using MV and JGB,respectively.The coating electroplated with MV at the orifice of blind via was bump-like,while the one electroplated with JGB was dimple-like.The microstructure analysis results showed that the preferential orientation of the copper coating electroplated with MV or JGB was(111)plane,the coating obtained with JGB was more even.