耐高低温苯基硅橡胶研究进展

Process in Research on the Phenyl Silicone Rubber with High and Low Temperature Resistance

苯基硅橡胶因其优异的耐温性与柔韧性等性能,在航空航天及电子封装等领域得到广泛应用。综述了近年来关于苯基硅橡胶耐温性能的研究进展,首先从主链刚性基团与封端基团种类以及分子序列结构、侧基种类与苯基含量等角度分析了硅橡胶的结构-性能关系,然后介绍了白炭黑,金属氧化物和硅树脂等填料对硅橡胶耐温性能的影响,概述了苯基硅橡胶的耐高低温特性研究现状.最后对苯基硅橡胶未来的研究方向和应用做了展望。

The phenyl silicone rubbers are usually employed in the field of aircraft and electronic packaging because of their outstanding temperature resistance and flexibility.The recent research on the temperature resistance of phenyl silicone rubber is summarized.Firstly,the structure-property relationship of silicone rubber is analyzed from the perspectives of main chain rigid group and terminated group types,as well as molecular se-quence structure,side group types and phenyl content.Then the influences of fillers such as fumed silica,metal oxide and silicone resin on the temperature resistance of silicone rubber are introduced.The status ot research on the characteristic of high and low temperature resistance of phenyl silicone rubber is reviewed.Finally,the future research direction and application of phenyl silicone rubber are described.