SPS制备难熔钼及钼钽溅射靶材的组织和性能

The Microstructure and Properties of Refractory Molybdenum and Molybdenum-Tantalum Sputtering Targets Fabricated by SPS

采用放电等离子体烧结(SPS)技术,在烧结温度1 400~1 600°C、保温时间5min及压力30 MPa下制备纯钼和两种不同成分(Mo-3%Ta、Mo-5%Ta,质量分数)的钼钽靶材。研究了烧结样品的物相、显微形貌、致密度、硬度及热导率,并与商业纯钼靶材的性能进行对比。结果表明:SPS烧结的钼靶材晶粒尺寸远小于商业纯钼靶材,在密度、硬度及热导率方面二者无明显差别。与SPS烧结的钼靶材相比,钼钽靶材的晶粒尺寸更小,密度相近,硬度值更高,但是热导率低。此外,随着钽含量的增加,钼钽靶材的热导率及晶粒尺寸减小且硬度增加。通过综合分析,可以确定Mo-5%Ta靶材的最佳烧结温度为1 400°C,相应的致密度为99.31%±0.25%、晶粒尺寸为1.93±0.32μm、维氏硬度为315.15±13.83及热导率(25°C)为148.037±5.169 W/(m·K)。

Pure molybdenum and two molybdenum-tantalum targets with different components(Mo-3%Ta, Mo-5%Ta,mass fraction) were fabricated by spark plasma sintering(SPS) technology at sintering temperatures of 1 400~1 600 °C and holding time of 5 min under 30 MPa. The phase, morphology, relative density, hardness, and thermal conductivity of the sintered samples were investigated and compared with commercial pure molybdenum target. The results show that the grain size of the molybdenum targets sintered by SPS is much smaller than that of the commercial molybdenum target, and there are no significant differences in the density, hardness, and thermal conductivity. Compared with molybdenum targets prepared by SPS, the molybdenum-tantalum targets possess smaller grain sizes, similar density, higher hardness, but the thermal conductivity would be declined. Additionally, with the increase of the tantalum content, the thermal conductivity and grain size of the molybdenum-tantalum targets decrease as well as the hardness increases. Based on the comprehensive analysis, the optimum sintering temperature of Mo-5%Ta target is 1 400 °C. Under optimized conditions, the corresponding relative density of Mo-5%Ta target is 99.31% ± 0.25%, the grain size is 1.93 ± 0.32 μm, the Vickers hardness is 315.15 ±13.83 and the thermal conductivity(25 °C) is 148.037 ± 5.169 W/(m·K).