金属/非金属纳米线连接及应用研究进展

Recent Progress of Metal/Nonmetal Nanowire Joining Technology and Its Applications

微纳连接是电子产品制造、封装、组装及功能化过程中的关键技术。纳米线由于独特的光学、电学及热学等特性,在小型化、多功能化的微纳电子器件中的作用日趋显著。因此,关于纳米线互连技术的相关研究已成为学术界和产业界共同的关注热点。与宏观尺度的互连相比,纳米线材料之间的互连在尺寸、结构及要求都具有一定的特殊性,这也催生了各种各样纳米连接方法的诞生与发展。综述了目前金属/非金属纳米线同质、异质连接的研究进展,归纳了常见的纳米线互连方法,如热致连接、光辐照连接、电场辅助连接及高能粒子束连接等方法及互连机制,介绍了其在柔性电子和其他微纳器件封装领域中的应用,并探讨了金属/非金属纳米线连接技术目前存在的问题及发展趋势。

Micro-nano joining process is a key technique in the manufacturing,packaging,assembly and functionalization of electronic products.Because of its unique optical,electrical and thermal properties,nanowires are playing an increasingly important role in miniaturized and multifunctional micro-nano electronic devices.Therefore,the research on nanowire joining technology has become a common focus of both academia and industry.Compared with the macroscopic interconnection,the interconnection between nanowires has certain particularity in size,structure and requirements,which also gives rise to the birth and development of a variety of nanowire interconnection methods.This paper reviews the current metal/nonmetal nanowires research progress of homogeneous and heterogeneous connection,sums up the common methods of nanowires interconnection,such as thermal joining,light irradiation,electric auxiliary joining and high energy beam joining method and their mechanism,such as in flexible electronics and other applications in the field of micro-nano device packaging.The existing problems and development trend of metal/nonmetal nanowire joining technology are also discussed.