化学镀法制备Cu@Ni@Ag复合粉末及其性能

Preparation of Cu@Ni@Ag powder by electroless plating and its properties

通过化学镀制备了包覆完整、壳层致密的银包镍包铜(标记为Cu@Ni@Ag)粉,重点研究了Ni含量和Ag含量对Cu@Ni@Ag粉形貌、抗氧化性及导电性的影响。结果表明:相比于Cu@Ag粉,Cu@Ni@Ag粉的抗氧化性明显提升,且随着Ni含量的升高而增强,但Cu@Ni@Ag粉的导电性不如Cu@Ag粉。Ag含量对Cu@Ni@Ag粉抗氧化性的影响不大,增大银含量能够改善Cu@Ni@Ag粉的导电性。当铜粉与化学镀镍液的镍离子和化学镀银液的银离子的物质的量之比分别为2.2和4.8时,所得的Cu@Ni@Ag粉具有较佳的导电性和高温抗氧化性。

A copper/nickel/silver(marked as Cu@Ni@Ag)composite powder covered with complete and compact coatings was prepared by electroless plating.The effects of Ni and Ag contents on morphology,oxidation resistance,and conductivity of the Cu@Ni@Ag powder were studied.The results showed that the Cu@Ni@Ag powder had better oxidation resistance but worse conductivity as compared with Cu@Ag powder.The oxidation resistance of the Cu@Ni@Ag powder became better with the increasing of Ni content.The oxidation resistance of Cu@Ni@Ag powder was hardly impacted by its Ag content,while its conductivity was improved with the increasing of Ag content.The Cu@Ni@Ag powder obtained at a molar ratio of 2.2 for copper powder to nickel ion in electroless nickel plating bath and 4.8 for copper powder to silver ion in electroless silver plating bath had excellent conductivity and oxidation resistance.