期刊文献+

界面电荷对圆柱形高k VDMOS的影响仿真研究

Simulation Study on the Effect of Interface Charge on Cylindrical High k VDMOS
下载PDF
导出
摘要 相比于传统VDMOS,超结耐压层结构和高k介质耐压层结构VDMOS能实现更高的击穿电压和更低的导通电阻。通过仿真软件,对3D圆柱形高k VDMOS具有、不具有界面电荷下的各种结构参数对电场分布、击穿电压和比导通电阻的影响进行了系统总结。研究和定性分析了击穿电压和比导通电阻随参数的变化趋势及其原因。对比导通电阻和击穿电压的折中关系进行了优化。该项研究对高k VDMOS的设计具有参考价值。 Compared with traditional VDMOS, the superjunction and high k dielectric structure VDMOS could achieve higher breakdown voltage and lower on-resistance. The effects of various structural parameters on electric field distribution, breakdown voltage and specific on-resistance of 3 D cylindrical high k VDMOS with and without interfacial charges were systematically summarized by simulation software. The variation trend and reason of breakdown voltage and specific on-resistance with parameters were studied and qualitatively analyzed. This study provided a reference for the design of high k VDMOS.
作者 刘乙 LIU Yi(Lab.of Integr.Circ.Design,Department of Electrical Engineering,Southwest Jiaotong Univ.,Chengdu 610000,P.R.China)
出处 《微电子学》 CAS 北大核心 2022年第1期109-114,共6页 Microelectronics
基金 国家自然科学基金资助项目(60906009)。
关键词 高介电常数耐压层 界面电荷 击穿电压 比导通电阻 high k voltage sustaining layer interface charge breakdown voltage specific on-resistance
  • 相关文献

参考文献2

二级参考文献20

  • 1杨银堂,朱海刚.BCD集成电路技术的研究与进展[J].微电子学,2006,36(3):315-319. 被引量:14
  • 2FT1500AU-120 Mitsubishi General Use Thyristor. . 1999
  • 3Majumdar G.The future of power devices. Proc.of IEEE APEC04 . 2004
  • 4Takahashi H,Haruguchi H,Hagino H,et al.Carrier Stored Trench-Gate Bipolar Transistor(CSTBT)-A Novel Power Device for High Voltage Application. ISPSD96 .
  • 5Mori M,Uchino Y,Sakano J,et al.A novel high-conductivity IGBT(HiGT)with a short circuit capability. Proc.ISPSD . 1998
  • 6Kitagawa M,Omura I,Hasegawa S,et al.4500V Injection Enhanced Insulated Gate Bipolar Transistor(IEGT)in a Mode Similar to a Thyritor. Proc.Of IEDM . 1993
  • 7Takeda T,Kuwahara M,Kamata S,et al.1200V trench gate NPT-IGBT(1egt)with excellent low on-st ate voltage. Proc.of ISPSD . 1998
  • 8Van Wyk J D.Power electronics technology at the dawn of a new century-past achievements and future expectations. Proc eedings of IPEMC . 2000
  • 9tling M,Lee H S,Domeij M,et al.Silicon Carbide Devices And Processes-Present Status And Future Perspective. Proc.of MIXDES . 2006
  • 10Steffen Bernet.Recent developments of high power converters for industry and traction application. IEEE Transactions on Power Electronics . 2000

共引文献37

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部