智能网卡的模态分析与随机振动仿真

Modal Analysis and Random Vibration Simulation of Smart NIC

智能网卡作为高性能设备在运输和使用过程中会受到外界的振动等因素影响,对智能网卡进行模态分析和随机振动仿真可以验证其在振动环境下的结构可靠性。利用有限元法首先对智能网卡的模态进行分析,确定结构振动特性,然后进行随机振动仿真,得出智能网卡的应力和变形云图,最后根据仿真数据对结构强度进行校核。结果表明:设计的智能网卡满足强度要求,在振动环境下具有结构可靠性。通过模态分析和随机振动仿真可以直接验证产品可靠性,缩短研发周期。

As a high-performance equipment,smart NIC will be affected by external vibration and other factors in the process of transportation and using.Modal analysis and random vibration simulation of smart NIC can be verified its structural reliability in vibration environment.In this paper,the finite element method is used to analyze the mode of smart NIC,determine the structural vibration characteristics,and then conduct random vibration simulation to obtain the stress and deformation nephogram of the smart NIC.Finally,the structural strength is checked according to the simulation data.The results show that the designed smart NIC can meet the strength requirements and has structural reliability in vibration environment.Through modal analysis and random vibration simulation,the product reliability can be directly verified and the R&D cycle can be shortened.