3D打印用纯钛粉末表面化学镀铜工艺研究

Study of electroless copper plating on TA0 powder used for 3D printing

利用化学镀方法在平均粒径为50μm的3D打印用TA0纯钛粉末表面镀铜,探讨了装载量、稳定剂、温度和pH值等关键工艺参数对TA0粉末表面化学镀铜的影响规律。利用扫描电子显微镜对Ti-Cu复合粉末表面镀铜层的形貌与均匀性进行观察,利用EDS分析镀层成分,利用X射线衍射技术分析镀层物相。结果表明:选用合适的溶液搅拌速度,采用化学镀可以成功在TA0粉末表面获得约80μm厚的均匀镀铜层;添加5 mg/L亚铁氰化钾稳定剂,装载量为12 g/100 mL,温度为60℃,pH值为11,可以获得质量较好的Ti-Cu复合粉末。

TA0 titanium powder with an average particle size of 50 μm is surface-modified by electroless copper plating, used for 3 D printing.The influences of powder weight, stabilizer, temperature and pH value have been investigated on electroless copper plating.The morphology and homogeneity are observed by electron scanning microscope.The coating composition is measured by EDS.The coating phase is analyzed by XRD.The results are as follows.When the suitable stirring velocity is used, a homogenous copper coating(approximately 80 μm thick)is obtained successfully by electroless copper plating on TA0 powder surface.The stabilizer is significant.The optimal parameters of powder weight, temperature and pH value are suggested to be 12 g/100 mL, 60 ℃ and 11, respectively.