基于多目标遗传算法的低温共烧陶瓷电路板典型结构优化

Research on Optimization of Typical Structure of Low Temperature Co-fired Ceramic Circuit Boards Based on Multi-objective Genetic Algorithm

在热环境中,低温共烧陶瓷电路板会出现相当大的热应力和形变,造成它的表面出现裂纹,严重影响其使用功能.为此,提出了基于多目标遗传算法的典型电路板结构优化研究.在热环境中,热分析低温共烧陶瓷电路板典型结构,并在热分析的基础上,分析优化典型结构中易形变的部位,达到减小其热应力的目的,以提高在热环境中电路板的力学特性,改善其力学性能,解决电路板在热环境下出现裂纹的问题.

In a hot environment,the low-temperature co-fired ceramic circuit board will have considerable thermal stress and deformation,which will cause cracks on its surface,which will seriously affect its function.For this reason,a typical circuit board structure optimization study based on multi-objective genetic algorithm is proposed.In the thermal environment,thermal analysis of the typical structure of the low-temperature co-fired ceramic circuit board,and on the basis of thermal analysis,analyzes and optimizes the deformable parts of the typical structure to reduce the thermal stress.And improve its mechanical properties in a hot environment,and solve the problem of cracks in the circuit board in a thermal environment.