摘要
阐述蓝牙5.0协议和WiFi的IEEE802.11ax协议为标准的物理层结构的待测设计,针对PHY模块算法的功能点搭建了多协议通用的UVM验证平台,满足多功能芯片的验证需求,多个协议共存的项目验证。
This paper expounds the Bluetooth 5.0 protocol and the IEEE802.2 protocol of Wi Fi 11 ax protocol is the design to be tested of the standard physical layer structure. Aiming at the function points of phy module algorithm, a multi protocol universal UVM verification platform is built to meet the verification requirements of multi-function chip and the project verification of coexistence of multiple protocols.
作者
逯淑纳
戴显英
王熙铭
LU Shuna;DAI Xianying;WANG Ximing(Xi'an University of Electronic Science and Technology,Shaanxi 710126,China)
出处
《集成电路应用》
2022年第3期114-115,共2页
Application of IC
关键词
物理层
蓝牙5.0
通用验证平台
physical layer
Bluetooth 5.0
general verification platform