基于小波变换优化的高速高精封装控制系统速度规划研究

Research on Speed Planning of High Speed High Precision Package Control System Based on Wavelet Transform Optimization

小型化、细间距的芯片对其封装运动系统的响应能力、定位精度和定位时间有着极高的要求,其运动平台需要在极短时间内快速、平稳、精确地运行到目标位置,即从控制方面实现高精度、高加速度和运动时间的最优规划。首先在7段标准S曲线速度规划基础上进一步改进为“高加加速度低减加速度”的非对称S曲线速度规划解决加速度突变问题并有效抑制系统超调和残余振动,接着根据位移开展非对称S曲线速度规划之后存在参数可调,在充分考虑系统特征的前提下从固有周期处频率激起能量强度尽可能低的角度在定位阶段采用Morlet小波变换展开优化得到最优的速度、加速度和加加速度值,解决S曲线引起的定位速度变慢问题。实验证明,采用本速度规划方法X轴的跟踪误差从15µm提高到1.5µm,定位时间从100 ms提高到15 ms,定位精度从70µm提高到10µm,Y轴提升也与X轴相当,该速度规划方法有效实现芯片封装控制系统的短行程、高加速、高速高精度定位要求。

Miniature and fine-spaced chip has extremely high requirements for the responsiveness,positioning accuracy and positioning time of packaging motor system,which need to run quickly,smoothly and accurately to the target location in a very short time,in terms of control,the optimal planning with high precision,high acceleration and motion time is needed.The acceleration mutation problem with asymmetric S curve velocity planning to effectively inhibit the system superharmonic residual vibration was firstly solved,and then the Morlet wavelet transform expansion optimization was used to obtain the optimal velocity and acceleration value to solve the problem of slow localization speed caused by the S curve.The experiment shows that the tracking error improvement of the X axis is from 15µm to 1.5µm,the positioning time improvement is from 100 ms to 15 ms,the positioning accuracy improvement is from 70µm to 10µm,the improvement of Y axis is also the same as X axis,that is,the speed planning method effectively meets the high acceleration,high speed and high precision positioning requirements of the chip package control system.