环氧灌封胶及在IGBT功率模块封装中的应用

Epoxy Potting Adhesive and Its Applications in IGBT Power Module Package

为了评估国产环氧灌封胶在绝缘栅双极晶体管(IGBT)功率模块封装中的应用情况,选取两种国产环氧灌封胶进行了综合对比,包括对两种环氧灌封胶固化前黏度、密度和凝胶时间,固化后的基本性能、热性能、绝缘性能等的横向对比。分析两种环氧灌封胶的差异,利用其分别封装IGBT功率模块,并对所封装的IGBT模块进行了高温存储、低温存储及温度循环等环境测试。结果表明:两种环氧灌封胶不同的增韧机理、混合比例、固化温度、机械强度和Tg值对封装均存在一定影响,而CTE值是影响环氧灌封胶在IGBT模块封装应用的最重要参数。

In order to evaluate the application of epoxy potting sealant in China on the packaging of insulated gate bipolar transistor(IGBT)power modules,we selected two domestic epoxy pouring sealant to compare their properties,including the viscosity,density,and gel time before curing,and the basic properties,thermal properties,and insulating properties after curing.The difference between the two epoxy potting sealants were analyzed,and IGBT power modules were encapsulated with them,respectively.Environmental tests such as high temperature storage,low temperature storage,and temperature cycle were conducted on the IGBT modules.The results show that the two epoxy potting adhesives have different toughening mechanism,mixing ratio,curing temperature,mechanical strength,and Tgvalue,which have some effect on the package.CTE value is the most important parameter that affects the application of epoxy potting adhesives in IGBT module package.