摘要
为准确计算高压单芯电缆线芯温度,提出将电缆中的绕包层、气隙层、皱纹铝护套层合并为包覆层进行优化热路建模的方法。首先对电缆实际结构进行分析,指出常规热路建模中电缆同心结构的不合理性,将包覆层分为3层建模引入的误差较大,会降低计算精度;然后提出将3层复杂结构统一化的优化建模方法,其中的热容热阻参数通过实验的方法获取;最后通过暂态温升实验并结合有限元仿真,验证了优化建模方法的有效性。结果表明:在采用优化后的暂态热路模型以及计算出的包覆层热阻热容参数计算电缆导体温度时,绝对误差的最大值由16.4℃降至2.7℃,相对误差最大值由24.06%降至4.45%,显著提高了计算精度。
In order to accurately calculate the core temperature of high-voltage single-core cable,a method of integrating the cladding layer,the air gap layer and the corrugated aluminum sheath layer into a coating layer to optimize the thermal circuit modeling is proposed.Firstly,this paper analyzes the actual structure of the cable,and points out the irrationality of the concentric structure in the conventional thermal circuit modeling.It states that the error introduced by the three-layer modeling of the coating layer is large,which will reduce the calculation accuracy.Then it proposes an optimization modeling method to unify the three-layer complex structure,in which the thermal capacitance and thermal resistance parameters are obtained through experimental methods.Finally,the effectiveness of the optimized modeling method is verified by transient temperature rise experiment combined with finite element simulation.The results show by using the optimized transient thermal circuit model,the calculated thermal resistance and thermal capacitance parameters of the coating to calculate the cable conductor temperature,the maximum absolute error is reduced from 16.4℃to 2.7℃and the relative error maximum value is reduced from 24.06%to 4.45%,which significantly improves the calculation accuracy.
作者
曾含
王健
韩卓展
刘顺满
范星辉
聂阳阳
刘刚
ZENG Han;WANG Jian;HAN Zhuozhan;LIU Shunman;FAN Xinghui;NIE Yangyang;LIU Gang(School of Electric Power,South China University of Technology,Guangzhou,Guangdong 510641,China;Guangzhou Power Supply Bureau of Guangdong Power Grid Co.,Ltd.,Guangzhou,Guangdong 510310,China)
出处
《广东电力》
2022年第4期87-95,共9页
Guangdong Electric Power
基金
中国南方电网有限责任公司科技项目(GZHKJXM20190049)。
关键词
高压单芯电缆
暂态热路模型
优化建模
有限元仿真
包覆层
high voltage single core cable
transient thermal circuit model
optimization modeling
finite element simulation
coating layer