环氧树脂板化学镀铜前微蚀和激光活化工艺优化

Optimization of microetching and laser activation processes before electroless copper plating on epoxy resin plate

先用碱性高锰酸钾溶液对环氧树脂板进行微蚀,再均匀涂覆由硫酸铜和次磷酸钠组成的活化液,接着利用激光诱导技术在基板表面获得具有催化活性的铜微粒,最后进行化学镀铜。重点研究了微蚀温度、微蚀时间和激光扫描速率对铜镀层覆盖率的影响。结果表明,当微蚀温度为70°C,微蚀时间为14 min,激光扫描速率为12 mm/s时,活化效果最佳,后续化学镀铜层的覆盖率达到100%,表面均匀致密,结合力良好。

Electroless copper plating was conducted on epoxy resin plate.The process flow mainly included:(1)microetching in alkaline potassium permanganate solution;(2)uniformly painting an activation solution composed of copper sulfate and sodium hypophosphite;(3)treating by laser irradiation to form copper particles with catalytic activity;and(4)electroless copper plating.The effects of microetching temperature and time as well as laser scanning rate on coverage of copper coating on epoxy resin plate were studied.The results showed that the activation efficiency was the best after being microetched at 70℃for 14 min followed by laser scanning at 12 mm/s.The subsequently electrolessly plated copper coating was uniform and compact with 100%coverage and excellent adhesion to the epoxy resin plate.