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低互调三频同轴腔体合路器的设计与实现

Design and realization of low intermodulation three-frequency coaxial cavity combiner
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摘要 设计了一种低无源互调的三频同轴腔体合路器。通过设计公共腔的抽头结构并对其相对腔体位置进行调谐,优化设计谐振腔之间台阶的高度,以降低互调失真,从而减小三阶互调。在满足设计指标的基础上设计一款基于DCS1800、TD-SCDMA2100、WLAN2600的低互调三频合路器,并进行了加工制作和实际测量。测量结果显示,得到3个频带的三阶互调值分别小于-172.50 dBc、-169.75 dBc、-173.30 dBc,满足要求,并验证了设计的可行性。 A three-frequency coaxial cavity combiner with low passive intermodulation is designed.By designing the tap structure of the common cavity and tuning its relative cavity position and optimizing the height of the steps between the resonant cavities,the intermodulation distortion is reduced,thereby reducing the third-order intermodulation.On the basis of meeting the design specifications,a low-intermodulation triple-frequency combiner based on DCS1800,TD-SCDMA2100,and WLAN2600 was designed,processed and measured.The measurement results satisfy that the third-order intermodulation values of the three frequency bands are less than-172.50 dBc,-169.75 dBc,and-173.30 dBc,respectively,and verify the feasibility of the design.
作者 葛雪飞 张需溥 游彬 Ge Xuefei;Zhang Xupu;You Bin(School of Electronic Information,Hangzhou Dianzi University,Hangzhou 310018,China;Hangzhou Ziguang Network Technology Co.,Ltd.,Hangzhou 310051,China)
出处 《电子技术应用》 2022年第4期108-112,共5页 Application of Electronic Technique
关键词 低互调 合路器 抽头 台阶 low intermodulation combiner tap step
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