一种高强度的Mini & Micro LED倒装技术研究

Research on a Mini & Micro LED Flip Technology with High Strength

LED显示屏经历了直插式、表贴式和集成式封装技术的发展,寻找合适的方法缩小LED像素点间距是目前研究的重点。倒装工艺制备LED是用锡膏实现线路板与倒装芯片相连,但存在锡膏连接层空洞、锡膏粘接力不足等问题。本文采用线路板植球技术,研究了植球工艺对锡膏粘接力和刷锡效果的影响。结果表明,植球后的锡膏偏移和锡膏塌陷明显改善,推力平均值比未植球高27.5%。为更小点间距的Mini&Micro LED显示器提供了技术参考。

LED displays have experienced the development of in-line, surface-mounted and integrated package. At present, the focus of LED display research is to find a suitable method to reduce the LED pixel spacing. Flip process is usually used to make circuit board and flip chip LED connected with solder paste, but there are problems such as cavity in solder paste connecting layer and insufficient adhesive force of solder paste. In this paper, we use the circuit board technology to plant the ball, to study the influence of the ball planting technology on the adhesion of solder paste and tin brush effect. The results show that the solder paste migration and collapse are improved obviously after the ball planting, and the average thrust is 27.5% higher than that without the ball planting. This provides a technical reference for Mini& Micro LED displays with even smaller pixel spacing.