摘要
采用热压烧结工艺制备石墨烯含量分别为0.1%、0.3%、0.5%和0.7%(质量分数)的Gr/CuCr10合金。与CuCr10合金相比,石墨烯添加量为0.3%(质量分数)的CuCr10复合材料相对密度保持不变,而电导率从62.2%(IACS)增加到69.5%(IACS)。导电率增加的主要原因是石墨烯的加入导致Cr相尺寸减小,从而减少电子的散射。此外,与CuCr10合金相比,0.3%Gr/CuCr10(质量分数)复合材料的布氏硬度从HB 91.8增加到HB 99.6。石墨烯主要分布在Cu和Cr的界面。通过HRTEM观察到的纳米Cr;C;相是Cu和Cr界面润湿性增强的主要原因,从而提高了材料的硬度。
Gr/CuCr10 alloys with graphene contents of 0.1 wt.%,0.3 wt.%,0.5 wt.%,and 0.7 wt.%were prepared by a hot pressing sintering process.Compared with CuCr10 alloy,the relative density of CuCr10 composite with 0.3 wt.%addition of graphene remained constant,while the electrical conductivity increased from 62.2%(IACS)to 69.5%(IACS).The main reason for the increased electrical conductivity is that the addition of graphene leads to the size reduction of Cr phase and thus reduces the scattering of electrons.In addition,Brinell’s hardness of 0.3 wt.%Gr/CuCr10 composite increased from HB 91.8 to HB 99.6 compared with that of CuCr10 alloy.The graphene was mainly distributed at the interface of Cu and Cr.A nano-Cr;C;phase,which has been observed through HRTEM,is the main reason for the wettability enhancement at the interface of Cu and Cr,thus improving the hardness of the material.
作者
冷金凤
周庆波
李展之
董云帆
夏昌鹏
Jin-feng LENG;Qing-bo ZHOU;Zhan-zhi LI;Yun-fan DONG;Chang-peng XIA(School of Materials Science and Engineering,University of Jinan,Jinan 250022,China;Jinan Chanyan Graphene Aluminum Material Technology Co.,Ltd.,Jinan 250031,China;Dingmei New Material Technology Co.,Ltd.,Suzhou 215300,China)
基金
financially supported by the National Natural Science Foundation of China(No.51871111)
Jinan Changan Graphene Aluminum Material Technology Co.,Ltd.,China
the Dingmei New Material Technology Co.,Ltd.,China。
关键词
石墨烯
CUCR合金
真空热压烧结
显微组织
电导率
graphene
CuCr alloy
vacuum hot pressing sintering
microstructure
electrical conductivity