铜线键合二焊点参数正交试验探析

Orthogonal Experimental Research on 2^(nd) Bond Parameters with Copper Wire Bonding

本文研究了影响二焊点键合力大小的关键因素:超声功率(A)、压力(B)、研磨次数(C)、振幅(D)、频率(E)对二焊点拉力的影响程度,采用正交试验法分析研究,得出各因素影响力大小为D>B>A>E>C,较优化的工艺方案为“A_(1) B_(1) C_(1) D_(2) E_(2)”。得出线性回归模型为Y=12.026-0.012A-0.017B-0.005C-0.174D-0.001E。通过实际验证,理论分析与实际相吻合。以上理论依据为20μm铜线键合的二焊点参数应用提供了指导方法。

This paper discusses the key factors affecting the wire bonding strength of 2^(nd) bond:USG(A),Force(B),Cycle Times(C),Amplitude(D),Frequency(E)on the influence degree of the 2^(nd) bond wire pull strength,which is analyzed and studied by orthogonal test method.It is concluded that the influence of each factor is D>B>A>E>C,the optimized process scheme is"A_(1)B_(1)C_(1)D_(2)E_(2)".The linear regression model is Y=12.026-0.012A-0.017B-0.005C-0.174D-0.001E.Through the practical verification,the theoretical analysis is in accordance with the actual situation.The above theoretical basis provides a guiding method for the application of 20μm 2^(nd) bonding parameters.