超大规模CCGA器件板级互联可靠性研究

Research on the Reliability of Board-level Interconnection of Ultra-large-scale CCGA Devices

以超大规模CCGA2577板级互联器件为研究对象,进行了温循过程可靠性模拟仿真和试验分析。首先,讨论了线型Pb90Sn10焊柱和铜带缠绕型Pb90Sn10焊柱阵列的板级互联可靠性及疲劳寿命,指出了两种焊柱下器件的危险失效点和失效模式;然后,结合试验对比验证了仿真模型的准确性,进一步地确认了焊柱直径和长度等参数对CCGA2577板级互联器件疲劳寿命的影响规律,给出了其板级互联可靠性结论;最后,针对超大规模CCGA器件板级互联可靠性设计给出了建议。

Taking the ultra-large-scale CCGA2577 board-level interconnection device as the research object,the reliability simulation and experimental analysis of the temperature cycling process are carried out.Firstly,the board-level interconnection reliability and fatigue life of the linear Pb90Sn10 solder column and copper tape wound Pb90Sn10 solder column array are discussed,and the dangerous failure points and failure modes of the devices under the two solder columns are pointed out.Then,the accuracy of the simulation model is verified by the comparison of experiments,and the influence rule of the diameter and length of the solder column on the fatigue life of CCGA2577 board-level interconnection devices is further confirmed,and the board-level interconnection reliability conclusions are given.Finally,the suggestions are given for the reliability design of the board-level interconnection of ultra-large-scale CCGA devices.